Documento de conferencia

Damping of resonances in a metallic enclosure through conductive polymers

Conference Proceeding cp
35th European Microwave Conference 2005 - Conference Proceedings
  • Volumen: 2
  • Fecha: 01 diciembre 2005
  • Páginas: 1399-1402
  • ISBN: 2960055128
  • Tipo de fuente: Ponencia
  • DOI: 10.1109/EUMC.2005.1610198
  • Tipo de documento: Documento de conferencia
In this paper the use of plastic compound patches for removing radiated interferences inside electronic equipments is studied. Absorption and reflection properties of conductive polymers have been analysed in order to damp the resonances in a metallic enclosure. A 2-D technique to obtain the shielding effectiveness of metallic enclosures with inner materials is evaluated. The influence of the conductivity of compounds and the location of the samples in the enclosure is studied. Results show that the 2-D technique can be used to evaluate cavity contents or for design purposes.

Palabras clave del autor

    Palabras clave indexadas

      Detalles de financiación